Methods of fabricating integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein

• Main Authors: LEE SOOOL, LEE HYAE-RYOUNG, AHN JONG-HYON
• Format: Patent
• Language: English
• Published: 15.10.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Bonding pads for integrated circuits include first and second spaced apart conductive layers, a third continuous conductive layer between the first and second spaced apart conductive layers and an array of spaced apart insulating islands in the third continuous conductive layer that extend therethrough such that sidewalls of the insulating islands are surrounded by the third continuous conductive layer. A fourth continuous conductive layer also may be provided between the third continuous conductive layer and the second conductive layer and a second array of spaced apart insulating islands may be provided in the fourth continuous conductive layer, that extend therethrough, such that sidewalls of the insulating islands are surrounded by the fourth continuous conductive layer. A fifth continuous conductive layer also may be provided between the third and fourth continuous conductive layers and a third array of spaced apart insulating islands may be provided in the fifth continuous conductive layer, that extend therethrough, such that sidewalls of the third array of insulating islands are surrounded by the fifth continuous conductive layer. The first and second arrays of spaced apart insulating islands preferably laterally overlap each other and may be congruent to each other. The third array of spaced apart insulating islands also may laterally overlap the first and second arrays. Preferably, the third array of spaced apart insulating islands are of the same shape as the first array, but of different sizes.