Photoimageable compositions and films for printed wiring board manufacture

Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compou...

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Bibliographic Details
Main Authors SANCHEZ PAUL A, LIU WEN-FENG, RUBIS DONALD E, FJARE DOUGLAS E, SINCLAIR DAVID P, HOBACK JOHN T, VANKIRK TERRE L, WARGOWSKI DAVID A
Format Patent
LanguageEnglish
Published 08.10.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.
Bibliography:Application Number: US19980218998