Photoimageable compositions and films for printed wiring board manufacture
Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compou...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
08.10.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed. |
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Bibliography: | Application Number: US19980218998 |