Composition for positive type photoresist

A photoresist composition including a polymer resin for forming a photoresist layer, a photosensitive chemical that changes the solubility of the photoresist layer when exposed to some form of radiation and 3-methoxybutyl acetate and 4-butyrolactone as a solvent, is provided. The composition has a g...

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Bibliographic Details
Main Authors JU JIN-HO, KIM KI-SOO, KANG SUNGUL, NAH YUN-JUNG, PARK HONG-SIK, LEE YU-KYUNG
Format Patent
LanguageEnglish
Published 10.09.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:A photoresist composition including a polymer resin for forming a photoresist layer, a photosensitive chemical that changes the solubility of the photoresist layer when exposed to some form of radiation and 3-methoxybutyl acetate and 4-butyrolactone as a solvent, is provided. The composition has a good photosensitivity and remainder ratio and no unpleasant odor.
Bibliography:Application Number: US20000650898