Arrangement and method for polishing a surface of a semiconductor wafer
An arrangement for polishing a semiconductor wafer is disclosed. The arrangement includes a plurality of preassembled polishing pad assemblies which can be selectively coupled to, and decoupled from, an actuating mechanism for rotating the polishing pad assemblies. An associated method of polishing...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
27.08.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | An arrangement for polishing a semiconductor wafer is disclosed. The arrangement includes a plurality of preassembled polishing pad assemblies which can be selectively coupled to, and decoupled from, an actuating mechanism for rotating the polishing pad assemblies. An associated method of polishing a semiconductor wafer is also disclosed. |
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Bibliography: | Application Number: US20000750639 |