Dry processing apparatus and dry processing method

• Main Authors: NISHIMURA HIROSHI, TOHNO ICHIRO, SAITO MAKOTO, TAKAGI SHIGEYUKI, ONOUE SEIJI
• Format: Patent
• Language: English
• Published: 11.06.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A dry processing apparatus includes a lower electrode for holding a substrate to be processed in a chamber, a shower head, provided to face a surface of the lower electrode, on which the substrate to be processed is placed, for supplying a process gas to the substrate to be processed, placed on the lower electrode, and a pumping channel formed to surround an outer circumference of the lower electrode, wherein a pumping gap portion for communicating a processing space formed between the lower electrode and the shower head, and the pumping channel with each other, is made such that a width of the gap portion differs between an exhaust pump side where the pumping channel is connected to an exhaust pump, and an opposite side thereto.