Semiconductor wafer review system and method

A semiconductor wafer review system and method. A method and system for front and back side review of semiconductor wafers is provided in various embodiments. Inspection data for the front side is used to position the wafer for front side review, and a wafer inverter is provided to flip the wafer fo...

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Bibliographic Details
Main Authors WOOTEN CHRIS, EHRICHS EDWARD E
Format Patent
LanguageEnglish
Published 04.06.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:A semiconductor wafer review system and method. A method and system for front and back side review of semiconductor wafers is provided in various embodiments. Inspection data for the front side is used to position the wafer for front side review, and a wafer inverter is provided to flip the wafer for back side review. Inspection data for the back side is used to position the wafer for back side review.
Bibliography:Application Number: US19980195300