Mounting substrate

A mounting substrate includes: a base substrate having a usable substrate region used as part of a product and an unusable substrate region to be discarded, the base substrate being subjected to soldering treatment in which the surface thereof is brought into contact with solder; and on-substrate me...

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Bibliographic Details
Main Author TSUCHIYA MICHITOSHI
Format Patent
LanguageEnglish
Published 21.05.2002
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A mounting substrate includes: a base substrate having a usable substrate region used as part of a product and an unusable substrate region to be discarded, the base substrate being subjected to soldering treatment in which the surface thereof is brought into contact with solder; and on-substrate members arranged on a soldering surface side, to be subjected to the soldering treatment, of the base substrate, the on-substrate members being in a state in which the surfaces have a wettability against solder upon soldering treatment. The on-substrate members are arranged in a non-contact portion with solder upon solder treatment in the unusable substrate region, in the usable substrate region, or in the non-contact portion and the usable substrate region. With this configuration, even if solder is stuck on the on-substrate members, any noxious material containing waste does not occur when the unusable substrate region is separated from the usable substrate region and is discarded.
Bibliography:Application Number: US20000500048