Wiring structure of semiconductor device and method for manufacturing the same

A wiring structure of a semiconductor device and a method for manufacturing the same are provided. The wiring structure according to the present invention includes a body formed of a conductive material in a first insulating film on a semiconductor substrate and a protrusion formed of a conductive m...

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Bibliographic Details
Main Authors MOON JAE-HWAN, KIM GYUUL
Format Patent
LanguageEnglish
Published 12.03.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wiring structure of a semiconductor device and a method for manufacturing the same are provided. The wiring structure according to the present invention includes a body formed of a conductive material in a first insulating film on a semiconductor substrate and a protrusion formed of a conductive material in a second insulating film formed on the first insulating film, connected to the upper surface of the body, formed to have a width less than that of the body, and having a planarized upper surface.
Bibliography:Application Number: US19990359243