Package construction of semiconductor device

A semiconductor device includes a ball grid array substrate including an upper insulating layer of laminated insulating layers, an intermediate insulating layer, and a lower insulating layer of laminated insulating layers; lines on each top surface of the insulating layers included in the upper insu...

Full description

Saved in:
Bibliographic Details
Main Author BABA SHINJI
Format Patent
LanguageEnglish
Published 13.11.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device includes a ball grid array substrate including an upper insulating layer of laminated insulating layers, an intermediate insulating layer, and a lower insulating layer of laminated insulating layers; lines on each top surface of the insulating layers included in the upper insulating layer, the intermediate insulating layer, and the lower insulating layer, respectively; and a semiconductor chip having electrodes connected to the lines, the semiconductor chip being connected with solder balls through via holes in each of the insulating layers, the solder balls being located on an outermost surface of the lower insulating layer.
Bibliography:Application Number: US19990427583