Method of molding plastic semiconductor packages

In the manufacture of semiconductor packages having molded plastic bodies, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium ("NTDC") coating prevents the surfaces from adhering to the pack...

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Bibliographic Details
Main Authors CROWLEY SEAN T, RAZU DAVID S, CHENEY GERALD L
Format Patent
LanguageEnglish
Published 30.10.2001
Edition7
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:In the manufacture of semiconductor packages having molded plastic bodies, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium ("NTDC") coating prevents the surfaces from adhering to the package body and ensures good package release, without formation of cracks or craters in the package body. This, in turn, permits the amount of both release agents and adhesion promoters used in the molding compound to be substantially reduced, or eliminated altogether, thereby resulting in a package body having improved strength and adhesion with the components of the package, and hence, an improved resistance of the package body to the propagation of cracks and its subsequent penetration by moisture.
Bibliography:Application Number: US19990441115