Polyimide precursor, polyimide and their use

A polyimide precursor having repeating units of the formula:wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparti...

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Bibliographic Details
Main Authors KIKKAWA HARUHIKO, HAGIWARA HIDEO, KOJIMA MITSUMASA, KOJIMA YASUNORI, KAJI MAKOTO
Format Patent
LanguageEnglish
Published 30.10.2001
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A polyimide precursor having repeating units of the formula:wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
Bibliography:Application Number: US20000634582