Method of applying a protective layer to a microelectronic component

A method of protecting an electronic component from damage, wherein the electronic component includes a semiconductor chip. According to the method, a first protective substance is applied to an outer surface of the semiconductor chip. The first protective substance has a coefficient of thermal expa...

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Bibliographic Details
Main Authors SMITH BRIAN K, SHIEL ROGER R
Format Patent
LanguageEnglish
Published 09.10.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of protecting an electronic component from damage, wherein the electronic component includes a semiconductor chip. According to the method, a first protective substance is applied to an outer surface of the semiconductor chip. The first protective substance has a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the semiconductor chip. A second substance may then applied to an outer surface of the first protective substance. The first protective substance is applied such that it protects the semiconductor chip from damage during the application of the second substance.
Bibliography:Application Number: US20000566523