Method for fabricating double sided ceramic circuit boards using a titanium support substrate

• Main Authors: SREERAM ATTIGANAL NARAYANASWAMY, PALIT KALIPADA, HOZER LESZEK, PRABHU ASHOK NARAYAN
• Format: Patent
• Language: English
• Published: 11.09.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

An integrated double sided metal supported display device has a green tape stack on both sides of the metal support. The green tape stacks incorporate circuitry and conductor filled vias to access the circuitry electrically on each green tape layer. The metal support has a plurality of openings to access both of the green tape stacks. These openings are made by forming the openings in the metal support, filling them with a dielectric that has a thermal coefficient of expansion close to that of the metal support, forming an opening in the dielectric and filling the opening with a conductive ink.