Protective coatings for metal-based substrates, and related processes

An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconn...

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Bibliographic Details
Main Authors PABLA SURINDER SINGH, GRAY DENNIS MICHAEL, LAU YUKIU, BOROM MARCUS PRESTON
Format Patent
LanguageEnglish
Published 14.08.2001
Edition7
Subjects
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Summary:An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconnected pores. A process is also described. It includes the step of applying a spongy, metallic bond layer over the substrate, followed by the application of a thermal barrier coating. A dense, primary bond layer may optionally be applied before the application of the spongy layer.
Bibliography:Application Number: US20000558258