Protective coatings for metal-based substrates, and related processes
An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconn...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
14.08.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconnected pores. A process is also described. It includes the step of applying a spongy, metallic bond layer over the substrate, followed by the application of a thermal barrier coating. A dense, primary bond layer may optionally be applied before the application of the spongy layer. |
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Bibliography: | Application Number: US20000558258 |