Electronic device package and leadframe and method for making the package

• Main Authors: BANCOD LUDOVICO, CROWLEY SEAN T, NIONES EULOGIA A, CHOI YEON HO, KHAM NHUN THUN
• Format: Patent
• Language: English
• Published: 10.07.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. The package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive tape. Encapsulant material covers the entire structure. The ring is connected to a lead identified for connection to an external power voltage supply. The ring in turn is connected to a power voltage input pad on the integrated circuit device. The die pad floats, or is connected to a lead that is connected to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive tape that connects the ring to the die pad. In one embodiment, the leadframe and package also include a bypass or decoupling capacitor attached between the die pad and the ring.