Methods for fabricating multi-component devices for molecular biological analysis and diagnostics

• Main Authors: ACKLEY DONALD E, LECLAIR TIMOTHY L, SWANSON PAUL D
• Format: Patent
• Language: English
• Published: 03.07.2001
• Edition: 7
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; BEER; BIOCHEMISTRY; BLASTING; CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; COMBINATORIAL CHEMISTRY; COMPOSITIONS OR TEST PAPERS THEREFOR; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL ORENZYMOLOGICAL PROCESSES; DERIVATIVES THEREOF; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENZYMOLOGY; GENERAL METHODS OF ORGANIC CHEMISTRY; HEATING; INFORMATION STORAGE; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LIBRARIES, e.g. CHEMICAL LIBRARIES, IN SILICOLIBRARIES; LIGHTING; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MEASURING; MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEICACIDS OR MICROORGANISMS; MECHANICAL ENGINEERING; METALLURGY; MICROBIOLOGY; MUTATION OR GENETIC ENGINEERING; NANOTECHNOLOGY; NUCLEIC ACIDS; NUCLEOSIDES; NUCLEOTIDES; ORGANIC CHEMISTRY; PEPTIDES; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PHYSICS; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS; PROCESSES OF PREPARING SUCH COMPOSITIONS; PUMPS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS; SEMICONDUCTOR DEVICES; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; SPIRITS; STATIC STORES; SUGARS; TESTING; THEIR RELEVANT APPARATUS; TRANSPORTING; VINEGAR; WEAPONS; WINE

A method for manufacturing a multicomponent flip-chip device is disclosed. The device includes a chip disposed adjacent to a substrate, the substrate including a via therethrough. The device is adapted to receive a fluid to be placed on the substrate, wherein the fluid then flows through the via down to the chip. The chip includes a sealant free region and a sealant receiving region. The method includes the steps of placing a chip adjacent to a substrate. Light is exposed to the substrate and through the via, down onto the surface of the chip. A light-curable, wickable sealant is applied to the interface between the substrate and the chip, wherein the light at least partially cures the sealant to preclude the sealant from flowing to the sealant free region. Additional curing of sealant may also be performed.