Semiconductor device

The semiconductor device comprises an insulating film having a device hole; inner leads disposed on one main face of the insulating film; a semiconductor element, which is mounted on the insulating film and connected to the ends of the inner leads; and a resin-encapsulating layer for covering such c...

Full description

Saved in:
Bibliographic Details
Main Authors GOTO MASAO, FUKUZAWA YUJI
Format Patent
LanguageEnglish
Published 10.04.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The semiconductor device comprises an insulating film having a device hole; inner leads disposed on one main face of the insulating film; a semiconductor element, which is mounted on the insulating film and connected to the ends of the inner leads; and a resin-encapsulating layer for covering such connections and the like, wherein the device hole of the insulating film has a flat shape externally protruded in the neighborhood of the middle on the short side, and a length of the long side containing the projections is larger than the corresponding length of the semiconductor chip. The expansion of the resin-encapsulating layer coated on the insulating film has a length on the short side of the semiconductor element larger than that on the long side. In a semiconductor device having the UNT structure in particular, a strength of adhesive between the resin-encapsulating layer and the insulating film on the short sides of the semiconductor chip is improved, a crack is prevented from being caused, and high reliability in connection can be obtained.
Bibliography:Application Number: US19980181870