Semiconductor device

The semiconductor device comprises an insulating film having a device hole; inner leads disposed on one main face of the insulating film; a semiconductor element, which is mounted on the insulating film and connected to the ends of the inner leads; and a resin-encapsulating layer for covering such c...

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Bibliographic Details
Main Authors GOTO MASAO, FUKUZAWA YUJI
Format Patent
LanguageEnglish
Published 10.04.2001
Edition7
Subjects
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Summary:The semiconductor device comprises an insulating film having a device hole; inner leads disposed on one main face of the insulating film; a semiconductor element, which is mounted on the insulating film and connected to the ends of the inner leads; and a resin-encapsulating layer for covering such connections and the like, wherein the device hole of the insulating film has a flat shape externally protruded in the neighborhood of the middle on the short side, and a length of the long side containing the projections is larger than the corresponding length of the semiconductor chip. The expansion of the resin-encapsulating layer coated on the insulating film has a length on the short side of the semiconductor element larger than that on the long side. In a semiconductor device having the UNT structure in particular, a strength of adhesive between the resin-encapsulating layer and the insulating film on the short sides of the semiconductor chip is improved, a crack is prevented from being caused, and high reliability in connection can be obtained.
Bibliography:Application Number: US19980181870