Method of processing semiconductor wafers to build in back surface damage

A method of processing a semiconductor wafer sliced from a single-crystal ingot includes lapping front and back surfaces of the wafer to reduce the thickness of the wafer and to improve the flatness of the wafer. The front surface is subjected to fine grinding to reduce the damage on the front surfa...

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Bibliographic Details
Main Author XIN YUN-BIAO
Format Patent
LanguageEnglish
Published 10.04.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method of processing a semiconductor wafer sliced from a single-crystal ingot includes lapping front and back surfaces of the wafer to reduce the thickness of the wafer and to improve the flatness of the wafer. The front surface is subjected to fine grinding to reduce the damage on the front surface while leaving damage on the back surface intact. The front and back surfaces are simultaneously polished to improve the flatness of the wafer and to reduce wafer damage on the front and back surfaces. The wafer damage remaining on the back surface is greater than the wafer damage on the front surface. The wafer damage remaining on the back surface facilitates gettering.
Bibliography:Application Number: US19990404428