Method for increasing working life of retaining ring in chemical-mechanical polishing machine
A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing p...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
27.03.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A method for increasing the working life of retaining rings in a chemical-mechanical polishing machine. The method includes adding an extra pad between a retaining ring and a carrier so that the retaining ring is prevented from slippage and pressure on wafer can be evenly spread over the polishing pad of a polishing machine. Therefore, the rate at which a retaining ring wears out in chemical-mechanical polishing operation can be greatly reduced, and the working life of a retaining ring can be doubled. |
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Bibliography: | Application Number: US19980114435 |