Production of insulating varnishes and multilayer printed circuit boards using these varnishes
An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering th...
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Main Authors | , , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
06.03.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties. |
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Bibliography: | Application Number: US19980057522 |