Production of insulating varnishes and multilayer printed circuit boards using these varnishes

An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering th...

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Main Authors ARIKE SHIGEHARU, NAKASO AKISHI, OTSUKA KAZUHISA, TAKANO NOZOMU, KUMASHIRO YASUSHI, TAKAHASHI ATSUSHI, MORITA KOJI, TANABE TAKAHIRO, KOBAYASHI KAZUHITO, YAMAMOTO KAZUNORI, FUJIMOTO DAISUKE, URASAKI NAOYUKI
Format Patent
LanguageEnglish
Published 06.03.2001
Edition7
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Summary:An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
Bibliography:Application Number: US19980057522