Thermal board used for bonding wires in semiconductor manufacturing process

A thermal board is used for bonding wires in semiconductor manufacturing process for providing high temperature to increase the wire bonding efficiency while preventing the die paddle of a lead frame from being oxidized. The thermal board has a base board and a platform disposed on the base board. T...

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Bibliographic Details
Main Authors TSAI YU-FANG, WANG CHINN
Format Patent
LanguageEnglish
Published 27.02.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A thermal board is used for bonding wires in semiconductor manufacturing process for providing high temperature to increase the wire bonding efficiency while preventing the die paddle of a lead frame from being oxidized. The thermal board has a base board and a platform disposed on the base board. The platform has a center portion defined therein a chamber to receive the die paddle. A plurality of supporting posts are formed on the bottom of the chamber to support the die paddle so that the die paddle does not directly contact with the bottom of the chamber.
Bibliography:Application Number: US19990384929