Electronic component having a tin alloy plating film

An electronic component has a body; a metal film formed on the body; and a tin alloy plating film formed on the metal film. The tin alloy plating film contains Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.

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Bibliographic Details
Main Authors KUNISHI TATSUO, FUJII YUKIKO, ENDO MASANORI, TOKUDA YU
Format Patent
LanguageEnglish
Published 27.02.2001
Edition7
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
RESISTORS
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Summary:An electronic component has a body; a metal film formed on the body; and a tin alloy plating film formed on the metal film. The tin alloy plating film contains Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.
Bibliography:Application Number: US19980206599