Grinding method of microelectronic device

A method of grinding a microelectronic device includes a step of preparing an abrasive member by crushing a solid-phase liquid into massive form and by compacting the crushed solid-phase liquid, an abrasive member by compacting a solid-phase gas, or an abrasive member by crushing a solid-phase liqui...

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Bibliographic Details
Main Author KAMIJIMA AKIFUMI
Format Patent
LanguageEnglish
Published 02.01.2001
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
PHYSICS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:A method of grinding a microelectronic device includes a step of preparing an abrasive member by crushing a solid-phase liquid into massive form and by compacting the crushed solid-phase liquid, an abrasive member by compacting a solid-phase gas, or an abrasive member by crushing a solid-phase liquid into massive form, by mixing the crushed solid-phase liquid with a solid-phase gas and by compacting the mixed solid-phase liquid and solid-phase gas, and a step of pressing a surface of the microelectronic device to be ground against the abrasive member.
Bibliography:Application Number: US19990361615