Encapsulation method of a polymer or organic light emitting device

The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with multiple polymer films to prevent the penetration of oxygen and moisture into an organic or polymer light emit...

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Bibliographic Details
Main Authors ZYUNG; TAE HYOUNG, HWANG; DO HOON, JUNG; SANG DON
Format Patent
LanguageEnglish
Published 21.11.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with multiple polymer films to prevent the penetration of oxygen and moisture into an organic or polymer light emitting device. Due to the encapsulation of polymer light emitting device with the multiple polymer films, exposure to moisture and oxygen are prevented, which are causes of device degradation. When using a plastic substrate whose the thermal endurance is high, simultaneously, it has a thermal endurance effect to the Joule heat during device operation. Accordingly, there can be fabricated an organic or polymer light emitting display whose lifetime is extended through the encapsulation of an organic of polymer light emitting device with multiple polymer films.
Bibliography:Application Number: US19980122755