Lightweight miniaturized integrated microsatellite employing advanced semiconductor processing and packaging technology

A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafer...

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Bibliographic Details
Main Author JOSHI; ABHAY M
Format Patent
LanguageEnglish
Published 24.10.2000
Edition7
Subjects
AIRCRAFT
ANTENNAS, i.e. RADIO AERIALS
AVIATION
BASIC ELECTRIC ELEMENTS
COSMONAUTICS
ELECTRICITY
PERFORMING OPERATIONS
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
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Summary:A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites.
Bibliography:Application Number: US19980178330