Semiconductor package with offset die pad

A semiconductor package includes a stiffener strip (10) having a die pad (18) and a body portion (12). A first surface (4) of the die pad (18) is offset from a second surface (3) of the body portion (12) a predetermined amount. The stiffener strip (10) includes an internal edge (27) concentrically d...

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Bibliographic Details
Main Authors JARMAN; HALL E, HASSANZADEH; NOZAR, STEARNS; WILLIAM P
Format Patent
LanguageEnglish
Published 29.08.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a stiffener strip (10) having a die pad (18) and a body portion (12). A first surface (4) of the die pad (18) is offset from a second surface (3) of the body portion (12) a predetermined amount. The stiffener strip (10) includes an internal edge (27) concentrically disposed about the die pad (18) and tie straps (16) connecting the internal edge (27) to the die pad (18). A die (28) is affixed to the first surface (4) of the die pad (18). A substrate (20) has a first surface (17) and a second surface (19), with the second surface (19) being affixed to the first surface (2) of the body portion (12). The substrate (20) includes a window (22) and conductive elements (24). A plastic molding material (33) encompasses the die (28), at least a portion of the stiffener strip (10), and at least a portion of the substrate (20).
Bibliography:Application Number: US19970994789