Thick film conductor paste compositions for aluminum nitride substrates

The invention relates to thick film conductor paste compositions with which thick film technology can be applied to aluminum nitride substrates and which can form a conductor as a thick film on a substrate by printing or coating and then firing and paste compositions as dispersions, which are obtain...

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Bibliographic Details
Main Author OKAMOTO; KUNINORI
Format Patent
LanguageEnglish
Published 15.08.2000
Edition7
Subjects
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEMENTS
CERAMICS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
LIME, MAGNESIA
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MINERAL OR SLAG WOOL
PRINTED CIRCUITS
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
TREATMENT OF NATURAL STONE
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Summary:The invention relates to thick film conductor paste compositions with which thick film technology can be applied to aluminum nitride substrates and which can form a conductor as a thick film on a substrate by printing or coating and then firing and paste compositions as dispersions, which are obtained by dispersing a conductive powder and a boride in an organic medium.
Bibliography:Application Number: US19970970265