Thick film conductor paste compositions for aluminum nitride substrates
The invention relates to thick film conductor paste compositions with which thick film technology can be applied to aluminum nitride substrates and which can form a conductor as a thick film on a substrate by printing or coating and then firing and paste compositions as dispersions, which are obtain...
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Main Author | |
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Format | Patent |
Language | English |
Published |
15.08.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to thick film conductor paste compositions with which thick film technology can be applied to aluminum nitride substrates and which can form a conductor as a thick film on a substrate by printing or coating and then firing and paste compositions as dispersions, which are obtained by dispersing a conductive powder and a boride in an organic medium. |
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Bibliography: | Application Number: US19970970265 |