System for connecting subsystems of dissimilar thermal properties
A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis; and a set of electrical connections providin...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
23.05.2000
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis; and a set of electrical connections providing a communications network between the circuit board and the integrated circuit package; wherein the integrated circuit package is thermally coupled to the second side of the chassis. |
---|---|
Bibliography: | Application Number: US19960777260 |