Fiberfill structure

A process of preparing new down-like clusters employs a method of point-bonding thermoplastic cut fibers in a stack of webs of carded fibers or continuous filaments in a tow, and then cutting and separating the resulting clusters which have an entirely different structure that is refluffable. Ultras...

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Bibliographic Details
Main Author MARCUS; ILAN
Format Patent
LanguageEnglish
Published 25.04.2000
Edition7
Subjects
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Summary:A process of preparing new down-like clusters employs a method of point-bonding thermoplastic cut fibers in a stack of webs of carded fibers or continuous filaments in a tow, and then cutting and separating the resulting clusters which have an entirely different structure that is refluffable. Ultrasonic bonding has worked well as the bonding method, but other methods may prove useful.
Bibliography:Application Number: US19980089892