Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish

A method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coa...

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Bibliographic Details
Main Authors PIETSCH; GEORG, SAUTER; BERND, FEUCHTINGER; ERNST
Format Patent
LanguageEnglish
Published 18.04.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coating being produced on one side of the semiconductor wafer; and has c) the semiconductor wafer being subjected to a second treatment which produces a double-sided finish.
Bibliography:Application Number: US19980003490