Transparent conductive composition, transparent conductive layer formed of the same, and manufacturing method thereof

• Main Authors: JUN; YOON-HO, CHO; YOON-HYUNG, LEE; JONG-HYUK, PARK; JONG-HWAN, ZANG; DONG-SIK
• Format: Patent
• Language: English
• Published: 30.11.1999
• Edition: 6
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GLASS; INKS; INSULATORS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MINERAL OR SLAG WOOL; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; USE OF MATERIALS THEREFOR; WOODSTAINS

A transparent conductive composition, a transparent conductive layer formed of the composition and a manufacturing method thereof are provided The composition contains a transparent conductive particle, metal alkoxide [M1(OR)4]; metal (M2) particles or salt thereof (M2X) and a catalyst. Here, the metal alkoxide [M1(OR)4] is one selected from the group consisting of Si(OR)4, Ti(OR)4, Sn(OR)4 and Zr(OR)4, where R is C1 DIFFERENCE C4 alkyl, and the metal (M2) is at least one selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), copper (Cu), nickel (Ni), lead (Pb), cobalt (Co), rhodium (Rh), ruthenium (Ru) and tin (Sn), and X is one selected from the group consisting of chloride, nitrate and sulfonate. Therefore, a transparent conductive layer having improved conductivity, transmittance and hardness can be obtained through a low-temperature sintering process.