Method and apparatus for facilitating detection of solder opens of SMT components

A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and seco...

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Bibliographic Details
Main Authors ARRIGOTTI; GEORGE, RAMPONE; THOMAS
Format Patent
LanguageEnglish
Published 12.10.1999
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
TESTING
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Summary:A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and second mounting pads coupled to a single electrical contact. The mounting pads are further coupled to corresponding access pads so that a first access pad is coupled to the first mounting pad while a second access pad is coupled to the second mounting pad. Electrical testing of the single electrical contact is possible through the completed circuit between the two access pads.
Bibliography:Application Number: US19960741053