Solder, electronic component mounted by soldering, and electronic circuit board

PCT No. PCT/JP96/01680 Sec. 371 Date Dec. 19, 1997 Sec. 102(e) Date Dec. 19, 1997 PCT Filed Jun. 19, 1996 PCT Pub. No. WO97/00753 PCT Pub. Date Jan. 9, 1997The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melti...

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Bibliographic Details
Main Authors FURUSAWA; AKIO, SUETSUGU; KENICHIRO, YAMAGUCHI; ATSUSHI, FUKUSHIMA; TETSUO
Format Patent
LanguageEnglish
Published 05.10.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PCT No. PCT/JP96/01680 Sec. 371 Date Dec. 19, 1997 Sec. 102(e) Date Dec. 19, 1997 PCT Filed Jun. 19, 1996 PCT Pub. No. WO97/00753 PCT Pub. Date Jan. 9, 1997The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
Bibliography:Application Number: US19970981565