Copper-containing plug for connection of semiconductor surface with overlying conductor

• Main Authors: GARDNER; MARK I, HAUSE; FRED N
• Format: Patent
• Language: English
• Published: 21.09.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An integrated circuit fabrication process is provided in which copper is used as the contact plug material for a via. The via is a hole etched through an interlevel dielectric which is disposed upon a semiconductor topography, e.g., a silicon-based substrate having junctions therein. An inert implan...