Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias

An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partia...

Full description

Saved in:
Bibliographic Details
Main Authors LIM; TONY KEAN-LEE, MEHR; BEHROOZ, BARROW; MICHAEL, LIM; AGNES SEOK-TUAN
Format Patent
LanguageEnglish
Published 10.08.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partially located over the opening. The solder ball has first and second opposed sides, the first side being adjacent the first wall and the second side being adjacent the second wall. The first side is nearer to the first wall than the second side is to the second wall.
Bibliography:Application Number: US19980087793