No wire bond plate (NWBP) packaging architecture for two dimensional stacked diode laser arrays

A high-power two-dimensional edge-emitting diode laser array comprises mounting modules, laser bars mounted on the modules, and protective caps mounted on the bars opposite the modules. The lasers are electrically connected in series through the modules and caps. The caps serve as laser bar protecto...

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Bibliographic Details
Main Authors ENDRIZ; JOHN G, HADEN; JAMES M, STASKUS; MICHAEL P
Format Patent
LanguageEnglish
Published 13.07.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:A high-power two-dimensional edge-emitting diode laser array comprises mounting modules, laser bars mounted on the modules, and protective caps mounted on the bars opposite the modules. The lasers are electrically connected in series through the modules and caps. The caps serve as laser bar protectors during the bar burn-in. The caps have grooves which compensate for tolerances in the thicknesses of the lasers, modules, and caps. The array is mounted on a base plate, and is in thermal communication with a heat sink. The caps and/or modules are thermal-expansion-matched to the laser bars. Eliminating the need for a wire bond plate allows shortening the modules.
Bibliography:Application Number: US19960736254