Duplexer package

A duplexer package comprises two surface acoustic wave filter chips having different band center frequencies and a phase matching circuit for matching the phases of the two SAW filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching ci...

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Bibliographic Details
Main Authors SATOH; YOSHIO, IKATA; OSAMU
Format Patent
LanguageEnglish
Published 12.01.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:A duplexer package comprises two surface acoustic wave filter chips having different band center frequencies and a phase matching circuit for matching the phases of the two SAW filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic wave filter chips. According to the present invention, the height of the duplexer package can be lowered.
Bibliography:Application Number: US19970812282