Method of manufacturing electronic component

An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the...

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Bibliographic Details
Main Authors OISHI; KUNIHIKO, UMEDA; SHINJI, NAKAMURA; TADASHI, ANDO; DAIZO
Format Patent
LanguageEnglish
Published 22.12.1998
Edition6
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
Bibliography:Application Number: US19970820546