Method and apparatus for dip solder processing

A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the pl...

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Bibliographic Details
Main Authors DODGE; THOMAS DALE, GENTRY; RONALD DALE
Format Patent
LanguageEnglish
Published 08.12.1998
Edition6
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the plunger during the soldering operation of the workpiece accomplishes continual flow across the soldered workpiece thereby removing any contaminants which rise to the surface or are introduced by the workpiece.
Bibliography:Application Number: US19960770106