forming a layer

PCT No. PCT/GB95/00259 Sec. 371 Date Oct. 2, 1995 Sec. 102(e) Date Oct. 2, 1995 PCT Filed Feb. 2, 1995 PCT Pub. No. WO95/22170 PCT Pub. Date Aug. 17, 1995The invention relates to apparatus for use in a process in which a layer is formed on a surface of a workpiece and then forced into underlying voi...

Full description

Saved in:
Bibliographic Details
Main Author DOBSON; CHRISTOPHER DAVID
Format Patent
LanguageEnglish
Published 01.12.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:PCT No. PCT/GB95/00259 Sec. 371 Date Oct. 2, 1995 Sec. 102(e) Date Oct. 2, 1995 PCT Filed Feb. 2, 1995 PCT Pub. No. WO95/22170 PCT Pub. Date Aug. 17, 1995The invention relates to apparatus for use in a process in which a layer is formed on a surface of a workpiece and then forced into underlying voids. The apparatus for applying elevated pressure to the workpiece 1 comprises a chamber 103 (which includes a workpiece support 109a) means 108 for flooding the chamber 103 with liquid to immerse a workpiece 1 on the support 109a and means for applying a pulse of elevated pressure to the liquid and hence the workpiece. These means may include a liquid reservoir 102, which shares a common flexible wall 101 with the chamber 103, and electrodes 100 and 104 to which a high voltage pulse can be supplied to create a shock in the liquid of reservoir 102 which is transmitted to the liquid in 103 via the wall 101.
Bibliography:Application Number: US19950530195