Ceramic integrated circuit package with optional IC removably mounted thereto

• Main Authors: KOCIS; THOMAS J, SWAMY; DEEPAK
• Format: Patent
• Language: English
• Published: 10.11.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A ceramic package for an integrated circuit (IC) and a method of manufacturing the ceramic package. The package comprises: (1) a ceramic body having opposing substantially planar first and second surfaces thereon, a cavity in the body and a plurality of vias passing through the body and intercepting the first and second surfaces, (2) an integral IC located within the cavity, (3) a plurality of electrical conductors located on the surfaces, passing through the plurality of vias and coupled to the IC, the plurality of conductors adapted to allow communication of electrical signals through the body and with the IC and (4) first and second electrical connectors located on the first and second surfaces, respectively, the first electrical connector allowing an optional IC to be removably mounted to the package and coupled to the plurality of electrical conductors, the second electrical connector allowing the package to be mounted to a supporting circuit board, the package thereby allowing the integral and optional ICs to communicate the electrical signals therebetween and with the circuit board.