Semiconductor body with a substrate glued to a support body

A semiconductor device comprises a substrate (1) with a plane surface (4) on which a layer structure (2) is formed in a number of layers (5, 7, 9, 13, 15, 17). The side of the substrate on which the layer structure was formed is fastened to a plane support body (18) by means of a glue layer (19) whi...

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Bibliographic Details
Main Authors VAN DEN EINDEN; WILHELMUS T. A. J, DEKKER; RONALD, MAAS; HENRICUS G. R, MICHIELSEN; THEODORUS M
Format Patent
LanguageEnglish
Published 27.10.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device comprises a substrate (1) with a plane surface (4) on which a layer structure (2) is formed in a number of layers (5, 7, 9, 13, 15, 17). The side of the substrate on which the layer structure was formed is fastened to a plane support body (18) by means of a glue layer (19) which encompasses spacer elements (20). These spacer elements are fastened to the surface of the substrate and all have the same height measured from the surface (4). In fastening the substrate to the support body, glue is provided and the substrate is pressed onto the support body so that the pressure is evenly distributed over the spacer elements.
Bibliography:Application Number: US19970815253