Semiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method therefor

A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at o...

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Main Authors HORI; RYOICHI, MIYAZAWA; KAZUYUKI, KIZAKI; TAKESHI, UCHIYAMA; HIROYUKI, IWAI; HIDETOSHI, AOYAGI; HIDETOMO, OGUCHI; SATOSHI, TAKEKUMA; TOSHITUGU, MATSUURA; HIROMI, TAKAHASHI; YASUSHI, II; HARUO, NAKAMURA; HISASHI, KOYAMA; YOSHIHISA, MURANAKA; MASAYA, SAKOMURA; SHIGETOSHI, ISHIHARA; MASAMICHI
Format Patent
LanguageEnglish
Published 08.09.1998
Edition6
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Summary:A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.
Bibliography:Application Number: US19950432867