Method and apparatus for depositing a multilayered low dielectric constant film
A method and apparatus for forming a multilayer insulating film on a substrate involves forming a number of carbon-based layers on the substrate, each interlaid with layers of organic material, such as parylene. Preferably, the carbon-based layers are formed using a high-density plasma chemical vapo...
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Main Author | |
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Format | Patent |
Language | English |
Published |
08.09.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | A method and apparatus for forming a multilayer insulating film on a substrate involves forming a number of carbon-based layers on the substrate, each interlaid with layers of organic material, such as parylene. Preferably, the carbon-based layers are formed using a high-density plasma chemical vapor deposition system, although other CVD systems may also be used. The result is a multilayer insulating film having a low overall dielectric constant, excellent gap-fill characteristics, and desirable thermal properties. |
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Bibliography: | Application Number: US19960749290 |