Method of making a device including a metallized magnetic substrate

• Main Authors: LIPTACK; DAVID JOSEPH, THOMSON, JR.; JOHN, ROY; APURBA, FLEMING; DEBRA ANNE, LAMBRECHT, JR.; VINCENT GEORGE, JOHNSON, JR.; DAVID WILFRED, LAW; HENRY HON
• Format: Patent
• Language: English
• Published: 08.09.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDUCTANCES; MAGNETS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSFORMERS

The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.