High temperature electromigration stress test system, test socket, and use thereof

A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450 DEG C. of VSLI interconnects.

Saved in:
Bibliographic Details
Main Authors SMITH; RICHARD GEORGE, RATHORE; HAZARA SINGH, EDWARDS; ROBERT DANIEL, NGUYEN; DU BINH, POULIN; JAMES JOSEPH
Format Patent
LanguageEnglish
Published 02.06.1998
Edition6
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450 DEG C. of VSLI interconnects.
Bibliography:Application Number: US19960715942