Paperboard packaging with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking

This invention relates to substrates for paperboard packing with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking. Such structures of this type, generally, reduce the edgewick in the paperboard package such that catastrophic failure of the paperboard pack...

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Bibliographic Details
Main Author CLAYTOR; ROBINSON CAMDEN PERKINS
Format Patent
LanguageEnglish
Published 05.05.1998
Edition6
Subjects
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Summary:This invention relates to substrates for paperboard packing with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking. Such structures of this type, generally, reduce the edgewick in the paperboard package such that catastrophic failure of the paperboard package is substantially reduced.
Bibliography:Application Number: US19950503175