Paperboard packaging with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking
This invention relates to substrates for paperboard packing with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking. Such structures of this type, generally, reduce the edgewick in the paperboard package such that catastrophic failure of the paperboard pack...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
05.05.1998
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | This invention relates to substrates for paperboard packing with an improved sizing layer including a styrene maleic anhydride binder for reducing edgewicking. Such structures of this type, generally, reduce the edgewick in the paperboard package such that catastrophic failure of the paperboard package is substantially reduced. |
---|---|
Bibliography: | Application Number: US19950503175 |