Thermal printing head

• Main Authors: PARK; SUNG-SOO, YANG; HONG-GEUN
• Format: Patent
• Language: English
• Published: 28.04.1998
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistors, which is located adjacent to the alumina substrate, a heat sink for discharging heat, wherein the heat sink is attached to the bottom of the print circuit board and the alumina substrate; and a driving IC mounted on the alumina substrate, each signal supplying aluminum pattern element thereof being formed of two portions having different widths which are alternately connected in a lengthwise direction along the signal supplying aluminum pattern. This arrangement minimizes or prevents contamination of the wire bonding pad due to bleeding of solder resist and non-conductive epoxy along the signal supplying aluminum pattern element during manufacturing processes.