Thermal printing head
A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistor...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
28.04.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Abstract | A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistors, which is located adjacent to the alumina substrate, a heat sink for discharging heat, wherein the heat sink is attached to the bottom of the print circuit board and the alumina substrate; and a driving IC mounted on the alumina substrate, each signal supplying aluminum pattern element thereof being formed of two portions having different widths which are alternately connected in a lengthwise direction along the signal supplying aluminum pattern. This arrangement minimizes or prevents contamination of the wire bonding pad due to bleeding of solder resist and non-conductive epoxy along the signal supplying aluminum pattern element during manufacturing processes. |
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AbstractList | A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistors, which is located adjacent to the alumina substrate, a heat sink for discharging heat, wherein the heat sink is attached to the bottom of the print circuit board and the alumina substrate; and a driving IC mounted on the alumina substrate, each signal supplying aluminum pattern element thereof being formed of two portions having different widths which are alternately connected in a lengthwise direction along the signal supplying aluminum pattern. This arrangement minimizes or prevents contamination of the wire bonding pad due to bleeding of solder resist and non-conductive epoxy along the signal supplying aluminum pattern element during manufacturing processes. |
Author | PARK; SUNG-SOO YANG; HONG-GEUN |
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Notes | Application Number: US19960743148 |
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RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
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Snippet | A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and... |
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SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
Title | Thermal printing head |
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